Ultra-thin Electroplated Diamond Wire Saw

The wires are used in manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive, they are perfect for precise cutting various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on. Also applies to laboratory or research institutes to conduct research.

Features:

1. Diameter: 0.17mm/0.20mm/0.27mm/0.30mm/0.35mm/0.45mm/0.5mm/0.6mm/1mm, diameter deviation ≤ 0.01mm;
2. Cutting wire material: imported high-quality and strength steel cutting wire;
3. Diamond grit: 5μm-60μm, we can design according to the customer's requirements;
4. Tensile strength: 3200-3400Mpa;
5. Wire length: we can made according to user's requirements.

Code No.	Diamond Size(um)	Min Circle Diameter(mm)	Min Breaking Load(N)	Application
LT-DWSUTE55	5-10	100	10	Silicon Slicing
LT-DWSUTE60	6-12	100	13.5	Silicon Slicing
LT-DWSUTE65	6-12/7-14	100	15.2	Silicon Slicing
LT-DWSUTE70	7-14	100	17.2	Silicon Slicing
LT-DWSUTE80	6-12/8-12	100	20.5	Silicon Slicing
LT-DWSUTE145	8-12/8-16	130	40	Magnetic Material Cutting
LT-DWSUTE180	30-40	130	49	Magnetic Material Cutting
LT-DWSUTE195	30-40	130	50	Magnetic Material Cutting
LT-DWSUTE210	23-35/30-40	130	60	Magnetic Material Cutting
LT-DWSUTE230	30-40	130	70	Sapphire Cutting
LT-DWSUTE240	30-40	130	78	Sapphire Cutting
LT-DWSUTE250	30-40	150	80	Sapphire Cutting
LT-DWSUTE260	30-40/35-45	150	83	Sapphire Cutting
LT-DWSUTE320	40-50	150	150	Silicon Bricking and Cropping
LT-DWSUTE350	40-50	150	200	Silicon Bricking and Cropping
LT-DWSUTE370	30-40/40-50	200	200	Silicon Bricking and Cropping
LT-DWSUTE420	40-50	200	280	Silicon Bricking/Squaring
LT-DWSUTE450	40-50	200	280	Silicon Bricking/Squaring

Relevant products:

Marble Quarry Cutting Stone Squaring Quarry+Squring Stone Quarry Cutting Concrete Cutting